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FORUM INFOFLEX keynote to explore convergence of flexo, hybrid and digital

FTA Board Chair Paul Teachout, business development at OMET Americas, will chair the session.

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By: Greg Hrinya

Editor, Label & Narrow Web

The Flexographic Technical Association (FTA) has announced that the 2026 FORUM INFOFLEX will kick-off it’s Tuesday, April 28 morning program with a keynote panel examining how flexographic, hybrid and digital technologies are converging to shape the future of packaging print.

The session, titled “Flexo, Hybrid, and Digital: Converging Paths for the Future of Packaging Print,” will take place from 8–9 a.m. at The Baird Center in Milwaukee, WI, USA. FTA Board Chair Paul Teachout, business development at OMET Americas, will chair the session.

Joining Teachout on the panel are senior executives from leading printing equipment suppliers:

  • Jason Cagle, director of sales, Windmoeller & Hoelscher
  • David Ellen, global divisional director, Domino
  • Steve Heinze, east regional vice president of sales, Mark Andy
  • Steve Lynn, executive director, Durst
  • Windell McGill, digital press launch manager, BW Converting

Print perspectives

During the session, panelists will share their perspectives on how flexo, hybrid, and digital technologies are evolving. The newest innovations are meeting the changing demands of packaging and label production. The discussion will explore where each technology delivers the greatest value today, how integration and innovation are reshaping production workflows, and what this convergence means for future investment decisions.

Attendees will gain strategic insight into how forward-thinking suppliers envision the next phase of packaging print performance, efficiency, and growth. The keynote is designed to help converters, suppliers, and industry professionals better understand how equipment advancements, automation, and workflow integration are influencing long-term operational strategy.

The Tuesday keynote builds on FORUM INFOFLEX’s focus on education and innovation. It will offer attendees executive-level perspectives on the technologies driving the industry forward.

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